CL32B335KBJNNWE Cap Ceramic 3.3uF 50V X7R 10% SMD 1210 125C T/R
From SAMSUNG
Capacitance | 3300000(pF) |
Case Style | Ceramic Chip |
Construction | SMT Chip |
Failure Rate | Not Required |
Lead Diameter (nom) | Not Required(mm) |
Microwave Application | YES |
Mounting Style | Surface Mount |
Number of Terminals | 2 |
Operating Temp Range | -55C to 125C |
Package / Case | 1210 |
Packaging | Tape and Reel |
Product Depth (mm) | 2.5(mm) |
Product Diameter (mm) | Not Required(mm) |
Product Height (mm) | 2.5(mm) |
Product Length (mm) | 3.2(mm) |
Rad Hardened | No |
Seated Plane Height | Not Required(mm) |
Technology | STANDARD |
Temp Coeff (Dielectric) | X7R |
Termination Style | Not Required |
Tolerance (+ or -) | 10% |
Voltage | 50VDC |
Wire Form | Not Required |